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SR-C400 / DIFFERENTIAL-DRIVE PLATFORM

SR-C40020 kg home robot development platform.

A mobile foundation for developing home robots for companionship, interaction and lightweight item delivery.

20 kg maximum payloadROS 1 / ROS 2Full specifications ↓
SR-C400 mobile robot chassis

IN-HOUSE ROBOTICS R&D

Engineered by Shining Robotics.

Mechanical, electrical and embedded development, motion control and in-house SLAM, localization, navigation, path planning and obstacle avoidance.

Explore our R&D capabilities ↗

SHINING GROUP MANUFACTURING

Built on an industrial foundation.

Established in 1995, Shining Group brings machining, sourcing, assembly, testing and quality management resources to prototype builds and production.

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PRODUCT FACTS

Specifications you can work with.

SR-C400 published specifications
Dimensions (L × W × H)400 × 400 × 260 mm
Platform weight30 kg
Maximum payload20 kg
Maximum navigation speed0.5 m/s
Battery (voltage / capacity)24 V / 10 Ah
NavigationLiDAR-SLAM
Navigation sensorsToF LiDAR × 1 / RGBD × 1 / IMU × 1
Network interfaceRJ45 (communication / routing)
Mechanical interfaceStructural mounting holes
Controls and expansionSystem switch, emergency stop, USB expansion
ROS versionROS 1 / ROS 2

All SR-C and SR-X700 chassis support ROS 1 and ROS 2. Confirm your ROS distribution, operating system, driver package, message definitions, control and feedback interfaces, and software delivery scope for the selected configuration.

INTEGRATION & CONFIGURATION

Define the platform around your system.

Mechanical integration

Structural mounting holes support upper-module integration. Confirm mounting drawings, load distribution and center of gravity.

Software & control

ROS 1 and ROS 2 support provides a basis for integration. Agree drivers, control commands, status feedback and navigation configuration.

Delivery scope

Confirm the hardware, accessories, software, documentation and technical support included in the quotation.

YOUR NEXT STEP

Confirm the fit before you commit.

Share the task, operating environment, payload, upper-module dimensions, ROS environment and expected quantity.